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6.1: Invited Paper: Flexible Electronics Packaging for Wearable Applications
Author(s) -
Cui Zheng
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14365
Subject(s) - bionics , citation , electronics , chinese academy of sciences , session (web analytics) , wearable technology , wearable computer , library science , computer science , engineering , electrical engineering , world wide web , china , artificial intelligence , history , archaeology , embedded system
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