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P‐118: Optimization of Folding Process for Flexible Electronic Device
Author(s) -
Chung Ko Chin,
Huang Zi Shuo,
Yu Yu Zhi,
Lai Yen Hue,
Wang Wan Tsang
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14256
Subject(s) - folding (dsp implementation) , trajectory , radius , process (computing) , electronics , yield (engineering) , computer science , substrate (aquarium) , materials science , simulation , mechanical engineering , engineering , physics , electrical engineering , geology , composite material , computer security , astronomy , operating system , oceanography
Recently, the folding process has attracted considerable attention for bezel‐less construction in flexible display field. From chip on glass (COG) to chip on plastic (COP), the bezel has been greatly reduced yet needing a more optimized technology to keep a high yield rate. In this study, a folding‐trajectory optimization of the minimum radius of flexible substrate electronics device could be defined by using simulation even if the final folding area is exactly the same. Two different concepts of folding trajectory model and five different folding radius functions of time were simulated in this study for the selection of the best folding trajectory.