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P‐60: Single‐Step Plasma‐Enhanced Chemical Vapor Deposition of Graphene on Cu Ink and Sputtered Cu Thin Films
Author(s) -
Lu Chen-Hsuan,
Leu Chyi-Ming,
Lee Tzong-Ming,
Yeh Nai-Chang
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14190
Subject(s) - graphene , materials science , inkwell , chemical vapor deposition , thin film , plasma , nanotechnology , sputtering , conductivity , deposition (geology) , chemical engineering , optoelectronics , composite material , chemistry , paleontology , physics , quantum mechanics , sediment , engineering , biology
Ink materials for Inkjet Printing generally suffer from low conductivity, whereas the thickness of Cu interconnects requires further reduction for better flexibility. Here we demonstrate successful growth of graphene on both Cu Ink and sputtered Cu by plasma‐enhanced chemical vapor deposition as a promising solution to address the aforementioned issues.