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P‐46: Fabrication and characterization of thick Cu films deposited on G8.5 LCD glass substrates for 8k and large TV panels
Author(s) -
Li Guo,
Hui Xia,
Zhiwei Tan,
Juncheng Xiao,
Hang Zhou
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14177
Subject(s) - materials science , fabrication , deposition (geology) , characterization (materials science) , electrical resistivity and conductivity , surface roughness , surface finish , grain size , composite material , bending , metallurgy , optoelectronics , nanotechnology , electrical engineering , geology , medicine , alternative medicine , pathology , paleontology , engineering , sediment
The deposition of thick Cu films on large glass substrates, for instance G8.5 and G10.5 is challenging but essential for large size and 8k TV sets. The inevitable temperature rising during metal deposition results in a series of severe issues such as film oxidation and glass bending, which have been seldom investigated. In the paper, the process issues leading by thick Cu film deposition have been disclosed and solutions have been discussed. Film properties as surface roughness, grain size and electrical resistivity have been characterized and the results will help improve the performance of thick Cu wires.