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69‐4: Late‐News‐Paper: High‐Transparency Adhesive‐Encapsulation Film for OLED Device
Author(s) -
Ohashi Satoru,
Baba Eiji,
Okuno Manami,
Hosoi Mai,
Shindo Yuki,
Takada Motoyuki
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14050
Subject(s) - encapsulation (networking) , oled , adhesive , materials science , passivation , transparency (behavior) , optoelectronics , composite material , computer science , layer (electronics) , computer network , computer security
We have developed pressure sensitive adhesive (PSA) as adhesive encapsulation film for OLED device. The developed PSAs are found to bring high reliability on OLED encapsulated with “face seal” method without inorganic passivation under 85°C and 85%RH over 500hr. The developed PSAs are also designed to satisfy both barrier ability and high transparency, allowing simple lamination without any heating.