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29‐1: Invited Paper: Analysis of Dynamic Strain on Foldable Devices
Author(s) -
Ando Nao,
Hyodo Kei,
Sasaki Hisao,
Ota Yoshihito,
Terasaki Nao,
Sasayama Tomoki,
Yokoi Yusuke,
Shishido Atsushi,
Akamatsu Norihisa,
Taguchi Ryo
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13893
Subject(s) - strain (injury) , dynamic stress , stress (linguistics) , stress–strain curve , computer science , structural engineering , materials science , engineering , dynamic loading , finite element method , medicine , linguistics , philosophy
Understanding of mechanical stresses on foldable devices is important to develop them. In other words, it is important to analyze dynamic strain by controlling motion profile, to design mechanical structure with lowered stress. In order to elucidate dynamic strain, here we explore several ways of strain analysis by novel methods.