Premium
22‐2: An Ultra‐thin Flexible Thin Film Encapsulation Structure with High Transmittance and Reliability
Author(s) -
Wang Youwei,
Sun Tao,
Qin Chengjie,
Zhang Song,
Wang Tao,
Zhang Ziyu,
Hong Rui
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13865
Subject(s) - transmittance , materials science , encapsulation (networking) , thin film , tandem , composite material , optoelectronics , layer (electronics) , thin layer , nanotechnology , computer science , computer network
We report an ultra‐thin film encapsulation structure composited of atomic layer deposition layer and organic layer, which show a 4% improvement in transmittance with tandem TFE film, especially for blue region (94% up to 99%) and a 60% thickness decrease of inorganic layer. The TFE film shows an excellent flexibility performance, there was no crack after 60/90 500 hour static bending for R2. It also shows good reliability, storage for 85/85 500h, which indicates a great potential application in flexible display, especially for bendable display.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom