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22‐2: An Ultra‐thin Flexible Thin Film Encapsulation Structure with High Transmittance and Reliability
Author(s) -
Wang Youwei,
Sun Tao,
Qin Chengjie,
Zhang Song,
Wang Tao,
Zhang Ziyu,
Hong Rui
Publication year - 2020
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13865
Subject(s) - transmittance , materials science , encapsulation (networking) , thin film , tandem , composite material , optoelectronics , layer (electronics) , thin layer , nanotechnology , computer science , computer network
We report an ultra‐thin film encapsulation structure composited of atomic layer deposition layer and organic layer, which show a 4% improvement in transmittance with tandem TFE film, especially for blue region (94% up to 99%) and a 60% thickness decrease of inorganic layer. The TFE film shows an excellent flexibility performance, there was no crack after 60/90 500 hour static bending for R2. It also shows good reliability, storage for 85/85 500h, which indicates a great potential application in flexible display, especially for bendable display.