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P‐6.2: Study of the Copper Corrosion by EUV and TMAH in Lithography Cleaning Process
Author(s) -
Wang Hu,
Sun Zhaoning,
Gao Pan,
Tu Lezhi,
Mo Chaode,
Sun Shiying,
Zhang Weimin
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13638
Subject(s) - corrosion , x ray photoelectron spectroscopy , scanning electron microscope , extreme ultraviolet lithography , materials science , copper , metallurgy , chemical engineering , analytical chemistry (journal) , nanotechnology , chemistry , composite material , environmental chemistry , engineering
In the display industry, when making Array substrates with Cu process, the cleaning treatment will cause the corrosion of the Cu film. Through process adjustment, this paper has obtained the method that can control the mura brought by Cu corrosion within the specification. The corrosion products were analyzed by X‐ray photoelectron spectroscopy and Energy Dispersive Spectrometer. Surface morphology after cleaning was studied by scanning electron microscopy. We confirmed that the main constituent of mura was Cu(OH) 2 , and EUV irradiation to convert Cu 2 O into CuO was the key, which provided a theoretical basis for thoroughly solving the related problem.