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P‐6.1: Review of Mask Haze in TFT Manufacturing
Author(s) -
Yang Cheng Yu,
Gao Yan Nan
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13637
Subject(s) - photolithography , haze , semiconductor device fabrication , process (computing) , manufacturing process , thin film transistor , computer science , materials science , optoelectronics , nanotechnology , chemistry , organic chemistry , layer (electronics) , wafer , composite material , operating system
Mask plays major role in the photolithography process during whole TFT manufacturing. The photolithography process transfers the desired pattern on mask into panel substrate, which forms some portions of device and performs some electric or optical functions. Due to pattern continuously duplicated, a correct pattern shape of mask is very important in the photolithography process. An abnormal pattern will results in huge loss of yield and cost. The haze, a foreign matter grown or deposited on the surface of mask, is already a prevalent phenomenon in TFT photolithography manufacturing or well known in semiconductor manufacturing. It is already well identified that it is highly related to the storage environment of mask, that is, the so called AMC (Airborne Molecular Contamination). A summarized mask haze classification based on past industrial service experience is proposed and a case study result with haze sampling at the site of mask manufacturer is followed in this review to show the understanding of the recently state of the art about mask haze in TFT industry.