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27.4: The Crevice Corrosion of Copper in TFT‐LCD Fabrication
Author(s) -
Chen Meng,
Li Guo,
Sun Yao,
Liu Huangzheng,
Liu Jing,
Xia Hui,
Tan Zhiwei,
Chiou Chung-yi
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13469
Subject(s) - crevice corrosion , metallurgy , materials science , copper , corrosion , molybdenum , etching (microfabrication) , fabrication , composite material , medicine , alternative medicine , layer (electronics) , pathology
In this work we investigated the crevice corrosion of copper and molybdenum dual metal, which is applied to metal electrode in amorphous silicon TFT backplane fabrication. The photo resist(PR) strip process after wet etching of metal was the position of crevice corrosion occurrence by analysing results of SEM images. Crevice has formed in stripping step and crevice corrosion of copper occurred in rinse step. The diluted stripper was the first factor of crevice formation, and oxygen depletion would be the key cause of copper crevice corrosion. The existence of chloride would increase the deterioration of crevice corrosion.