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P‐171: The Mechanism of the OLED Reliability Failure for Thin Film Encapsulation in Lateral Direction
Author(s) -
Wang Tao,
Sun Tao,
Xie Chunyan,
Wang Youwei,
Qin Chengjie,
Zhang Ziyu,
Zhou Weifeng,
Zhang Song
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13328
Subject(s) - encapsulation (networking) , materials science , failure mechanism , oled , thin film , composite material , nanotechnology , optoelectronics , computer science , computer network , layer (electronics)
The failure mechanism for the thin film encapsulation (TFE) structure in the lateral direction was studied. A series of lateral distances for TFE was achieved by the development of the low‐temperature etching process. Taking the distance and the adhesion force into consideration, a failure model was established.