P‐171: The Mechanism of the OLED Reliability Failure for Thin Film Encapsulation in Lateral Direction | Zendy

Wang Tao | Zendy; Sun Tao | Zendy; Xie Chunyan | Zendy; Wang Youwei | Zendy; Qin Chengjie | Zendy; Zhang Ziyu | Zendy; Zhou Weifeng | Zendy; Zhang Song | Zendy

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P‐171: The Mechanism of the OLED Reliability Failure for Thin Film Encapsulation in Lateral Direction

Author(s) -

Wang Tao,

Sun Tao,

Xie Chunyan,

Wang Youwei,

Qin Chengjie,

Zhang Ziyu,

Zhou Weifeng,

Zhang Song

Publication year - 2019

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.13328

Subject(s) - encapsulation (networking) , materials science , failure mechanism , oled , thin film , composite material , nanotechnology , optoelectronics , computer science , computer network , layer (electronics)

The failure mechanism for the thin film encapsulation (TFE) structure in the lateral direction was studied. A series of lateral distances for TFE was achieved by the development of the low‐temperature etching process. Taking the distance and the adhesion force into consideration, a failure model was established.

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