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P‐130: Analysis of Mechanical Stresses on Foldable Devices
Author(s) -
Ando Nao,
Hyodo Kei,
Sasaki Hisao,
Ota Yoshihito,
Terasaki Nao
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13254
Subject(s) - stress (linguistics) , structural engineering , materials science , mechanical engineering , engineering , computer science , philosophy , linguistics
Knowledge of mechanical stresses on foldable devices is the key factor to develop them. When you study stresses, you should control motion profile then study dynamic stress. In our study, we reproduce some motions on our folding tester, compare a result of simulation and real mechanical stress.