Premium
P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp
Author(s) -
Greene Raymond G.,
Ishikawa Tomohiro,
Akarapu Ravindra K.
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.13221
Subject(s) - thermal expansion , materials science , chip , substrate (aquarium) , leakage (economics) , composite material , bending , engineering , electrical engineering , economics , macroeconomics , oceanography , geology
Based on application of heated bi‐metal strip bending theory to measured chip warp on 0.5 mm thick bare Corning ® EAGLEXG ® Glass and Corning Lotus™ NXT Glass, low substrate CTE minimizes chip warp. Different substrates have different effective process temperatures. Chip warp is relatively insensitive to substrate Young’s modulus vs. substrate CTE.