74‐1: A New Flexible Thin Film Encapsulation Structure with High Reliability and Wide Color‐Viewing‐Angle | Zendy

Guo Tianfu | Zendy; Wang Kan | Zendy; Lu Rui | Zendy; Fan Congcong | Zendy; Wang Yijia | Zendy; Huang Jing | Zendy; Hsu Hsiang Lun | Zendy

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74‐1: A New Flexible Thin Film Encapsulation Structure with High Reliability and Wide Color‐Viewing‐Angle

Author(s) -

Guo Tianfu,

Wang Kan,

Lu Rui,

Fan Congcong,

Wang Yijia,

Huang Jing,

Hsu Hsiang Lun

Publication year - 2019

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.13108

Subject(s) - viewing angle , encapsulation (networking) , materials science , flexible display , optoelectronics , thin film , computer science , nanotechnology , layer (electronics) , thin film transistor , liquid crystal display , computer network

We report a new thin film encapsulation structure composited of atomic layer deposition layer and organic wrinkles, which show a 13% improvement in color‐viewing‐angle with no decrease in storage lifetime. We also made a demo with the new TFE film, and shows an excellent flexibility performance, which indicates a great potential in wide viewing‐angle flexible display applications.

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