Premium
46‐1: Invited Paper: High Impact Resistance Out‐Fold Touch AMOLED Display Module
Author(s) -
Chen Glory,
Chang Kai-Ming,
Chen Kuan-Ting,
Chen Heng-Yin,
Lee Chien-Ju,
Ho Jia-Chong,
Chen Jang-Lin,
Lee Cheng-Chung
Publication year - 2019
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12999
Subject(s) - amoled , materials science , bend radius , fold (higher order function) , drop (telecommunication) , composite material , bending , electrical engineering , mechanical engineering , engineering , layer (electronics) , thin film transistor , active matrix
Out‐fold AMOLED display is requested higher panel hardness and impact resistance than in‐fold AMOLED display. The high mechanical strength technology was integrated in 7.1 inch foldable AMOLED display module. A 3mm bending radius out‐fold touch AMOLED prototype with hardness 7H plastic window is demonstrated. This prototype can pass the ball drop impact test of 135g weight from a height of 35cm.