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9‐3: Flexible Mutual‐capacitive Fingerprint Sensor with Hard and Flexible Overlaid Dielectric Layer for Biometrics Application
Author(s) -
Lee Seung Hee,
Jeon Guk-Jin,
Kim Yong Ho,
Kang Il-Suk,
Kim Hongchae,
Bae Byeong-Soo,
Park Sang-Hee Ko
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12565
Subject(s) - fingerprint (computing) , capacitive sensing , dielectric , materials science , layer (electronics) , biometrics , fingerprint recognition , capacitance , electrode , optoelectronics , noise (video) , photoresist , substrate (aquarium) , signal (programming language) , electronic engineering , computer science , electrical engineering , nanotechnology , artificial intelligence , engineering , physics , oceanography , image (mathematics) , geology , quantum mechanics , programming language
We present cost‐effective flexible fingerprint sensor for biometrics application beyond Si‐based material. Our Cu electrode based fingerprint sensors were fabricated on PI substrate with flexible and durable overlaid dielectric material. Overlaid layer has roles of both the dielectric layer of capacitance and protective layer from the environment in place of reinforced glass. The planarization of Cu electrode suppresses generation of noise signal between the electrodes, resulting in realistic fingerprints.