Premium
24‐3: Hot‐Melt‐Type Face‐Sealing Encapsulation for Flexible OLEDs
Author(s) -
Inoue Hiroyasu,
Murata Naoki,
Harai Kenichi,
Kashiwagi Motofumi
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12547
Subject(s) - oled , materials science , encapsulation (networking) , adhesive , transparency (behavior) , composite material , optoelectronics , computer science , layer (electronics) , computer network , computer security
We have developed a face sealing sheet of flexible OLED in which hygroscopic particles are dispersed, based on a hot melt type adhesive. By using this sheet in combination with a gas barrier film, degradation of emitting area of OLED was suppressed. Also, it offers transparency, flexibility and adhesion.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom