Premium
24‐3: Hot‐Melt‐Type Face‐Sealing Encapsulation for Flexible OLEDs
Author(s) -
Inoue Hiroyasu,
Murata Naoki,
Harai Kenichi,
Kashiwagi Motofumi
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12547
Subject(s) - oled , materials science , encapsulation (networking) , adhesive , transparency (behavior) , composite material , optoelectronics , computer science , layer (electronics) , computer network , computer security
We have developed a face sealing sheet of flexible OLED in which hygroscopic particles are dispersed, based on a hot melt type adhesive. By using this sheet in combination with a gas barrier film, degradation of emitting area of OLED was suppressed. Also, it offers transparency, flexibility and adhesion.