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P‐134: Lamination Contact Bonding and Mechanical Detaching of PI Film for Manufacturing of Flexible OLED Displays
Author(s) -
Yang Seung-Yeol,
Kim Chan-Soo,
Choi Jong-Sun,
Kim Yong-Seog
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12317
Subject(s) - materials science , oled , lift (data mining) , lamination , laser , coating , composite material , process (computing) , mechanical engineering , layer (electronics) , optoelectronics , computer science , optics , engineering , physics , data mining , operating system
In this work, we attempted to develop a new PI film bonding and mechanical detaching process which may be capable of replacing conventional PI film forming process, i.e., vanish coating followed by a thermal curing process and then laser lift‐off process. The new process developed showed that the mechanical detaching force is similar to that of laser lift‐off process.