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P‐132: Mechanical Deformation‐Aware TFT Modeling for Highly Flexible Wearable Electronics Design
Author(s) -
Mijalković Slobodan,
Nejim Ahmed,
Barquinha Pedro,
Scott Ian
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12315
Subject(s) - wearable technology , electronics , deformation (meteorology) , spice , wearable computer , bending , computer science , mechanical design , flexible electronics , thin film transistor , mechanical engineering , electronic engineering , materials science , engineering , embedded system , electrical engineering , structural engineering , nanotechnology , layer (electronics) , composite material
A modeling methodology and design tools for mechanical deformation‐aware design of highly flexible wearable electronics are presented. A new 3D TCAD meshing tool is developed to explore the effects of bending on electrical characteristics of IGZO TFTs for e‐fiber applications. A generic meta‐modeling approach to extend the standard SPICE TFT models for mechanical deformation‐aware circuit simulation and design is proposed.