P‐132: Mechanical Deformation‐Aware TFT Modeling for Highly Flexible Wearable Electronics Design | Zendy

Mijalković Slobodan | Zendy; Nejim Ahmed | Zendy; Barquinha Pedro | Zendy; Scott Ian | Zendy

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P‐132: Mechanical Deformation‐Aware TFT Modeling for Highly Flexible Wearable Electronics Design

Author(s) -

Mijalković Slobodan,

Nejim Ahmed,

Barquinha Pedro,

Scott Ian

Publication year - 2018

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.12315

Subject(s) - wearable technology , electronics , deformation (meteorology) , spice , wearable computer , bending , computer science , mechanical design , flexible electronics , thin film transistor , mechanical engineering , electronic engineering , materials science , engineering , embedded system , electrical engineering , structural engineering , nanotechnology , layer (electronics) , composite material

A modeling methodology and design tools for mechanical deformation‐aware design of highly flexible wearable electronics are presented. A new 3D TCAD meshing tool is developed to explore the effects of bending on electrical characteristics of IGZO TFTs for e‐fiber applications. A generic meta‐modeling approach to extend the standard SPICE TFT models for mechanical deformation‐aware circuit simulation and design is proposed.

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