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P‐126: Thin Film Stress Optimization for Bending Resistance Improvement of Flexible AMOLED Display
Author(s) -
Zhang Huijuan,
Li Xiaolong,
Li Liangjian,
Li Dong,
Li Zhao,
Liu Zheng,
Kao Shanchen,
Wang Dawei
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12310
Subject(s) - amoled , materials science , bend radius , bending , backplane , stress (linguistics) , composite material , optoelectronics , thin film transistor , computer science , layer (electronics) , computer hardware , active matrix , linguistics , philosophy
In order to improve the bending resistant of flexible AMOLED display, the stress of thin film should be well researched. In this paper, we analysis the defect of transversal line, which was very serious after module bending, metal crack was found in the process of TFT backplane. We solved the issue of metal crack by adjusting the stress of the backplane compound film. The bending resistant of the flexible screen was improved finally. We successfully fabricated a 5.46inch QHD flexible AMOLED display which passed one hundred thousand times bending test in a bending radius of 5mm.