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67‐3: Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability
Author(s) -
Park Seongmin,
Park Hyuk,
Chung Yoonyoung
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12245
Subject(s) - bent molecular geometry , flexibility (engineering) , substrate (aquarium) , bending , flexible electronics , materials science , strain (injury) , layer (electronics) , flexible display , strain engineering , composite material , optoelectronics , nanotechnology , silicon , geology , medicine , statistics , oceanography , mathematics , thin film transistor
We propose a novel substrate structure to achieve excellent mechanical flexibility. Electronic components on a flexible substrate are affected by surface strain when bent. Our flexible substrate contains a strain‐absorbing layer that can effectively reduce the surface strain; thus, flexible devices can be more flexible with minimal electrical degradation.