82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method | Zendy

Ke Tsung-Ying | Zendy; Lee Chih-Tsung | Zendy; Cheng Kuei-Ning | Zendy; Su Wei-Jen | Zendy; Kang Ting | Zendy; Wang Wan-Tsang | Zendy; Liu Chun-Hsin | Zendy; Lin Yu-Hsin | Zendy

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82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method

Author(s) -

Ke Tsung-Ying,

Lee Chih-Tsung,

Cheng Kuei-Ning,

Su Wei-Jen,

Kang Ting,

Wang Wan-Tsang,

Liu Chun-Hsin,

Lin Yu-Hsin

Publication year - 2018

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.12121

Subject(s) - substrate (aquarium) , oled , materials science , electronics , flexible electronics , flexible display , optoelectronics , composite material , nanotechnology , thin film transistor , electrical engineering , layer (electronics) , engineering , oceanography , geology

By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production.

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