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82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method
Author(s) -
Ke Tsung-Ying,
Lee Chih-Tsung,
Cheng Kuei-Ning,
Su Wei-Jen,
Kang Ting,
Wang Wan-Tsang,
Liu Chun-Hsin,
Lin Yu-Hsin
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12121
Subject(s) - substrate (aquarium) , oled , materials science , electronics , flexible electronics , flexible display , optoelectronics , composite material , nanotechnology , thin film transistor , electrical engineering , layer (electronics) , engineering , oceanography , geology
By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production.