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82‐4: Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra‐Fine Pitch Chip‐on‐Glass (COG) Interconnection
Author(s) -
Yoon Dal-Jin,
Paik Kyung-Wook
Publication year - 2018
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12117
Subject(s) - cog , interconnection , electrical conductor , materials science , particle (ecology) , anchoring , layer (electronics) , electrode , flip chip , composite material , optoelectronics , computer science , engineering , structural engineering , chemistry , telecommunications , adhesive , oceanography , artificial intelligence , geology
In this study, APL has been introduced into the ACFs system. Then, the effects of APL ACFs properties on the conductive particle movement and interconnection stability of ultra‐fine pitch COG applications were investigated. The APL structure can not only significantly suppress the conductive particles movement for ultra‐fine pitch COG applications but also prevent electrical short circuit formation between electrodes. After ACFs bonding process, the percentage of captured conductive particles of the conventional ACFs was 33%, however, that of PAN APL ACFs showed 95%. In addition, the APL ACFs showed excellent electrical properties such as stable contact resistance without any open or short circuits.