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P‐130: A Proof‐of‐Concept Study for Optimizing Encapsulation Structure for Flexible Electronics Devices Based Novel Thin Gas Barrier Film
Author(s) -
Naganawa Satoshi,
Nishijima Kenta,
Iwaya Wataru,
Kashio Mikihiro,
Izumi Tatsuya
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.12012
Subject(s) - electronics , flexible electronics , encapsulation (networking) , bend radius , materials science , curvature , nanotechnology , optoelectronics , electrical engineering , bending , computer science , engineering , composite material , mathematics , geometry , computer network
An optimum encapsulation structure for flexible electronics devices was presented by theoretically and experimentally. Optimum encapsulated test device whose gas barrier layer was located around neutral‐axis passed 10,000 cycles of 2 mm radius of curvature bending test. For design of flexible electronics devices, to locate the most fragile layer near neutral‐axis is very effective strategy to achieve high flexibility.