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P‐80: A Study about the Metal Corrosion and Diffusion Phenomenon in Cu‐Mo Dual Layer Metal Wires for TFT‐LCDs
Author(s) -
Wu Yue,
Li Shan,
Ge Shimin,
Xiong Yuan,
Jiang Chunsheng
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11944
Subject(s) - corrosion , materials science , layer (electronics) , thin film transistor , metal , metallurgy , galvanic corrosion , diffusion , galvanic cell , composite material , physics , thermodynamics
Due to the low resistance and excellent glass adhesion, Cu/Mo dual‐layer metal wire has been widely used in TFT‐LCD industry. However, the galvanic reaction between the two metals, which may be the main cause of metal corrosion and diffusion in some failure TFT devices, has been seldom reported. According to the detailed study of the wet and rinse process, this work proposes a possible corrosion mechanism.