Premium
P‐67: An Analytical Method of Small‐Sized Module Waving Based on the Finite‐Element Simulation
Author(s) -
Zhang Bingchuan,
Zheng Yingbo,
Lin Yanfeng,
Zhou Gege,
Lv Chengling
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11932
Subject(s) - finite element method , reliability (semiconductor) , coupling (piping) , element (criminal law) , computer science , mechanical engineering , structural engineering , engineering , physics , thermodynamics , power (physics) , political science , law
The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of waving.