P‐67: An Analytical Method of Small‐Sized Module Waving Based on the Finite‐Element Simulation | Zendy

Zhang Bingchuan | Zendy; Zheng Yingbo | Zendy; Lin Yanfeng | Zendy; Zhou Gege | Zendy; Lv Chengling | Zendy

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P‐67: An Analytical Method of Small‐Sized Module Waving Based on the Finite‐Element Simulation

Author(s) -

Zhang Bingchuan,

Zheng Yingbo,

Lin Yanfeng,

Zhou Gege,

Lv Chengling

Publication year - 2017

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.11932

Subject(s) - finite element method , reliability (semiconductor) , coupling (piping) , element (criminal law) , computer science , mechanical engineering , structural engineering , engineering , physics , thermodynamics , power (physics) , political science , law

The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of waving.

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