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P‐64: The Property Differences of Copper Thin Films Deposited by One‐step and Multi‐step DC Magnetron Sputtering Technique
Author(s) -
Xia Hui,
Zhou Zhichao,
Hu Xiaobo,
Li Jiayu,
Tan Zhiwei
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11929
Subject(s) - materials science , sputter deposition , cavity magnetron , thin film , copper , one step , pulsed dc , sputtering , optoelectronics , two step , high resolution , metallurgy , nanotechnology , chemical engineering , chemistry , engineering , remote sensing , geology , combinatorial chemistry
To match the products such as large‐size and high‐resolution TFT‐LCD, the thicker Cu films with lower resistance are needed. A comparative study of microstructural and electrical properties of the Cu films with different thickness (420‐1040nm) deposited by one‐step and multi‐step dc magnetron sputtering technique is presented in this paper.