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P‐60: Implementing Narrow Bezel Design through Black Sealant
Author(s) -
Lim JiWon,
Hong SangPyo,
Kang DongWoo,
Choi YoungSeok,
Shin SangMun
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11923
Subject(s) - sealant , curing (chemistry) , reflection (computer programming) , materials science , computer science , composite material , programming language
To reduce the size of the bezel, it is necessary a Black Sealant that can be UV cured by C/F glass. The Optical density of the Black Sealant should be 0.4/um or more to blocking circuit pattern reflection and glare. In this study, we examined the risk of curing Black Sealant.
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