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P‐40: 12. 3 inch Automotive Free‐form Curved Cluster
Author(s) -
Ma Qing,
Sun Pai,
Zhang Ruichen,
Xiao Wenjun,
Zhang Zhipeng,
Tong Zeyuan,
Cui Dong,
Lin Donglong,
Yu Yangbing,
Han Rui,
Sun Lingyu,
Yoon D.K,
Li Zhifu
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11907
Subject(s) - zigzag , automotive industry , cluster (spacecraft) , radius , reliability (semiconductor) , curvature , free form , computer science , engineering , engineering drawing , physics , geometry , mathematics , power (physics) , computer security , quantum mechanics , programming language , aerospace engineering
BOE has made 12.3 inch automotive free‐form curved cluster. GIA layout, separated driving and curve radius 700mm were designed to realize free form curved cluster. Besides, bottom IC placement were applied to get narrow border, separated zigzag pixel arrangement were applied to get free form, and glass slimming were applied to get curved. Stress simulation was done to alleviate L0 light leak for curved module. Thermal simulation and optical simulation were also done to improve the performance. In transition phase, some designs will be optimized to avoid reliability risk.