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82‐1: Distinguished Paper : Glass Substrate for Micro Display Devices
Author(s) -
Hayashi Kazutaka,
Nomura Shuhei,
Sakai Yusuke
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11861
Subject(s) - materials science , wafer , substrate (aquarium) , thermal expansion , shrinkage , composite material , silicon , thermal , optoelectronics , oceanography , physics , meteorology , geology
Glass substrate suitable for wearable micro display devices for augmented/virtual reality was developed. This glass has highly matched thermal expansion coefficient with that of silicon and it enables to suppress amount of warpage caused by the boding between Si and glass wafers. The glass also shows lower thermal shrinkage than that of conventional non alkali glass for thin film transistor substrate. In this paper, the effect of the temperature dependence of CTE on warpage generation after bonding process was investigated using both numerical simulation and experiment. The newly developed glass showed remarkably low warpage after the bonding process.