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P‐10: High‐Density Plasma Sputtered InZnSnO Thin‐Film Transistors Fabricated by Back Channel Etching Method on Flexible Polyimide Substrate
Author(s) -
Cho Sung Haeng,
Kim Hee-Ok,
Park Eun-Suk,
Kwon Oh-Sang,
Yang Jong-Heon,
Hwang Chi-Sun,
Lee Jeong-Rak,
Do Jae-Chul,
Park Wan-Woo,
Roh Yong-Suk
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11860
Subject(s) - materials science , fabrication , sputtering , optoelectronics , thin film transistor , polyimide , etching (microfabrication) , substrate (aquarium) , layer (electronics) , plasma etching , transistor , dry etching , thin film , capacitance , nanotechnology , electrical engineering , electrode , voltage , chemistry , medicine , oceanography , alternative medicine , engineering , pathology , geology
We demonstrate the fabrication of high performance InZnSnO thin‐film transistors (TFT) with the field‐effect mobility of 25 cm 2 /Vs on about 10 um‐thin polyimide substrate. Back‐channel etch (BCE) process in the bottom gate configuration is employed for easy implementation of devices with shorter channel length and smaller parasitic capacitance and cost‐effective fabrication compared with devices with etch‐stop layer (ESL). For highly uniform electrical characteristics with high field‐effect mobility, InZnSnO are deposited by high density plasma (HDP) sputtering which is assisted by microwave in order to enable the thin‐film more densified compared with conventional sputtering method. The combination of HDP sputtering method for oxide deposition and BCE process provides highly uniform electrical characteristics of TFTs with high mobility and cost‐effective method for their fabrication in large area flexible substrate.