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31‐3: Gas‐Barrier Adhesive Sheet as a Face‐sealing Encapsulation for Flexible OLEDs
Author(s) -
Nishijima Kenta,
Hasegawa Tatsuki,
Kashio Mikihiro
Publication year - 2017
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.11669
Subject(s) - encapsulation (networking) , adhesive , materials science , oled , curing (chemistry) , composite material , layer (electronics) , computer science , computer network
We demonstrated thermal curing encapsulation adhesive sheets for the flexible organic light emitting diodes. The thermal curing adhesive sheets were newly designed for the face‐sealing encapsulation sheet and had sufficient interface adhesion between the device surface and gas barrier films, high optical transparency, and flexible properties.