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78‐1: Invited Paper : Foldable AMOLED Integrated with On‐cell Touch and Edge Sealing Technologies
Author(s) -
Chen Janglin,
Ho Jia-Chong,
Chen Glory,
Yeh Ming-Hua,
Lee Yuh-Zheng,
Lee Cheng-Chung
Publication year - 2016
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10923
Subject(s) - amoled , backplane , materials science , bend radius , optoelectronics , bending , electrical engineering , engineering , thin film transistor , composite material , layer (electronics) , active matrix
A 5 mm bending radius foldable on‐cell touch AMOLED is successfully demonstrated with foldable TFT backplane, thin film encapsulation, and an on‐cell touch front plate. Aided by computer simulation, we develop the 60 μm thick AMOLED structure, and introduce new backplane design to minimize the mechanical stress. For improved reliability, we also propose an edge sealing technology to the foldable AMOLED.