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71‐1: Invited Paper : Additive Printing of Flexible Electronics
Author(s) -
Ng Tse Nga,
Mei Ping,
Ready Steve,
Whiting Greg,
Schwartz David,
Veres Janos
Publication year - 2016
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10884
Subject(s) - microprocessor , electronics , printed electronics , digital printing , simple (philosophy) , electronic component , printed circuit board , flexible electronics , fabrication , computer science , 3d printing , embedded system , electrical engineering , engineering , engineering drawing , mechanical engineering , medicine , philosophy , alternative medicine , epistemology , pathology
Digital, additive printing of electronic materials allows rapid, highly customizable fabrication, and low‐cost printed electronics are compelling for internet‐of‐things applications that require large volume of distributed devices, such as in sensor networks and smart packaging. The functionalities required of the embedded devices will vary over a broad spectrum from simple passive tags to powerful microprocessor controllers. In our prototype development, we apply two progressive printing approaches: simple systems are inkjet printed entirely from solution electronic inks, whereas more complex functions are met by printing interconnects between silicon ICs and printed passive components, to combine the advantages of flexible printed devices with the high performance of silicon chips.