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71.1: High Throughput and Scalable Spatial Atomic Layer Deposition of Al 2 O 3 as a Moisture Barrier for Flexible OLED Display
Author(s) -
Choi Hagyoung,
Shin Seokyooon,
Choi Yonghyuk,
Choi Yeongtae,
Kim Junghun,
Kim Sanghun,
Kim Hyungkyu,
Park Jongsik,
Chung Seog Chul,
Jeon Hyeongtag,
Oh Kiyoung
Publication year - 2015
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10378
Subject(s) - atomic layer deposition , throughput , substrate (aquarium) , layer (electronics) , deposition (geology) , oled , materials science , scalability , moisture , nanotechnology , optoelectronics , computer science , composite material , telecommunications , geology , database , wireless , paleontology , oceanography , sediment
We have developed high throughput and scalable space divided atomic layer deposition (ALD) system for thin filmencapsulation (TFE) of flexible OLEDs display. In this paper, we report high moisture barrier properties of Al 2 O 3 films deposited by our new developed high throughput (70 Å/min) spatial ALD with 2G glass substrate size (370 × 470 mm 2 ). The WVTR on flexible substrate could achieve ∼10 −5 g/m 2 ‐day under tritium test.