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P‐63: Effect of Glass Substrate Characteristics on Pattern Tolerance in Inverted Staggered Type TFT Array Fabrication
Author(s) -
Hayashi Kazutaka,
Kato Yasumasa,
Kunigita Masaya
Publication year - 2015
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10129
Subject(s) - fabrication , materials science , thin film transistor , distortion (music) , deposition (geology) , substrate (aquarium) , composite material , thermal expansion , modulus , optoelectronics , layer (electronics) , cmos , medicine , amplifier , paleontology , oceanography , alternative medicine , pathology , sediment , geology , biology
Deformation during a TFT fabrication process affects pattern tolerance because out of plane displacement may cause distortion of projected image of the pattern such as TFT, wiring, black matrix etc. The effect of glass properties on warpage caused during gate metal deposition and gate insulator deposition was investigated through numerical simulation. We found that thermal expansion coefficient of the glass substrate as well as Young's modulus should be taken into account to reduce the warpage.