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P‐62: Silicone Adhesive Providing Protection, Waterproofing and Reworkability for Precision Assembly of Electronic Devices
Author(s) -
Schneider Ryan F.,
Gordon Glenn V.,
Kim Sung Hyun,
Lee Gwang Su,
Tonge James S.
Publication year - 2015
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10128
Subject(s) - waterproofing , silicone , durability , adhesive , materials science , flexibility (engineering) , composite material , adhesive bonding , process engineering , engineering , layer (electronics) , statistics , mathematics
The performance of a unique silicone hot‐melt bonding solution for device fabrications is described. Inherent attributes of traditional silicones including water repellency, chemical resistance and durability are augmented with automated precision hot‐melt delivery. Other properties include instant room‐temperature adhesion to provide ingress and impact protection while allowing manufacturers the benefit of reworkability and design flexibility.