P‐87: Applying Low Temperature Thin Film Encapsulation to 6‐inch IGZO Flexible AMOLED | Zendy

Lai MingHsiang | Zendy; Liu ShengFa | Zendy; Huang ChingYu | Zendy; Chiou JiYi | Zendy; Chiu YiWen | Zendy; Liu YenWei | Zendy; Niu YiFan | Zendy

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P‐87: Applying Low Temperature Thin Film Encapsulation to 6‐inch IGZO Flexible AMOLED

Author(s) -

Lai MingHsiang,

Liu ShengFa,

Huang ChingYu,

Chiou JiYi,

Chiu YiWen,

Liu YenWei,

Niu YiFan

Publication year - 2015

Publication title -

sid symposium digest of technical papers

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.351

H-Index - 44

eISSN - 2168-0159

pISSN - 0097-966X

DOI - 10.1002/sdtp.10034

Subject(s) - amoled , oled , video graphics array , encapsulation (networking) , materials science , optoelectronics , composite material , computer science , thin film transistor , layer (electronics) , computer network , active matrix , cmos

Applying a high performance thin‐film barrier to OLED products conventionally needs high temperature process, but OLED devices would be damaged by heat. In this paper, we apply a low temperature encapsulation process to 6‐inch VGA IGZO AMOLED display, and get through the 60°C/90% RH over 500 hrs environment test, and WVTR is about 10 ‐5 g/m 2 ·day.

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