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P‐87: Applying Low Temperature Thin Film Encapsulation to 6‐inch IGZO Flexible AMOLED
Author(s) -
Lai MingHsiang,
Liu ShengFa,
Huang ChingYu,
Chiou JiYi,
Chiu YiWen,
Liu YenWei,
Niu YiFan
Publication year - 2015
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.10034
Subject(s) - amoled , oled , video graphics array , encapsulation (networking) , materials science , optoelectronics , composite material , computer science , thin film transistor , layer (electronics) , computer network , active matrix , cmos
Applying a high performance thin‐film barrier to OLED products conventionally needs high temperature process, but OLED devices would be damaged by heat. In this paper, we apply a low temperature encapsulation process to 6‐inch VGA IGZO AMOLED display, and get through the 60°C/90% RH over 500 hrs environment test, and WVTR is about 10 ‐5 g/m 2 ·day.