Open AccessIon beam‐sputtered and magnetron‐sputtered thin films on cytoskeletons: A high‐resolution tem study
Author(s) -
Lindroth M.,
Sundgren JE.
Publication year - 1989
Publication title -
scanning
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.359
H-Index - 47
eISSN - 1932-8745
pISSN - 0161-0457
DOI - 10.1002/sca.4950110508
Subject(s) - materials science , granularity , sputter deposition , cavity magnetron , ion beam , thin film , deposition (geology) , sputtering , analytical chemistry (journal) , tungsten , optics , optoelectronics , nanotechnology , beam (structure) , chemistry , metallurgy , chromatography , computer science , physics , paleontology , sediment , biology , operating system
A comparison of ion beam‐sputtered and magnetron‐sputtered thin platinum (Pt) and tungsten (W) films was made. Cytoskeletons from detergent extracted glioma cells grown on gold grids were coated with Pt or W at thicknesses of 1, 1.5, and 2.5 nm. Transmission electron micrographs were taken at high magnification and the granularity of the metal films was evaluated both on the Formvar film and the filaments of the cytoskeleton. In order to make a comparison between the two deposition methods, the metal deposition rate must be equal when corresponding thicknesses are made. Since ion beam sputtering generally is a slower process than magnetron sputtering, an increased target to specimen distance was necessary with the latter technique. This resulted in a coarser granularity of the W films as compared with the ion beam sputtered. The Pt, however, showed no marked difference between the two techniques at equal deposition rates. The study also demonstrated that varying the deposition rate caused differences in the granularity of the magnetron‐sputtered Pt and W films, even if the voltage of the target was kept constant. Decreasing the target to specimen distance which increased the deposition rate resulted in a finer granularity of both the Pt and the W films. At the highest deposition rate the granularity of both the Pt and W films was comparable with the granularity of the ion beam‐sputtered films.