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Stability of disubstituted copper complexes in the gas phase analyzed by electrospray ionization mass spectrometry
Author(s) -
Starke Ines,
Kammer Stefan,
Holdt HansJürgen,
Kleinpeter Erich
Publication year - 2010
Publication title -
rapid communications in mass spectrometry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.528
H-Index - 136
eISSN - 1097-0231
pISSN - 0951-4198
DOI - 10.1002/rcm.4519
Subject(s) - chemistry , electrospray ionization , copper , mass spectrometry , isopropyl , ligand (biochemistry) , alkyl , electron ionization , ionization , ion , inorganic chemistry , medicinal chemistry , analytical chemistry (journal) , organic chemistry , chromatography , biochemistry , receptor
A series of nitrogen ligand (L)/copper complexes of the type [Cu I L] + , [Cu II L(X)] + and [Cu I L 2 ] + (X = Cl – , BF 4 – , acac – , CH 3 COO – and SO 3 CF 3 – ) was studied in the gas phase by electrospray ionization mass spectrometry. The following ligands (L) were employed: 1,12‐diazaperylene ( dap ), 1,1′‐bisisoquinoline ( bis ), 2,2′‐bipyridine ( bpy ), 1,10‐phenanthroline ( phen ), 2,11‐disubstituted 1,12‐diazaperylenes ( dap ), 3,3′‐disubstituted 1,1′‐ bisisoquinoline ( bis ), 5,8‐dimethoxy‐substituted diazaperylene ( meodap ), 6,6′‐ dimethoxy‐substituted bisisoquinoline ( meobis ) and 2,9‐dimethyl‐1,10‐phenanthroline ( dmphen ). Collision‐induced decomposition measurements were applied to evaluate the relative stabilities of the different copper complexes. The influence of the spatial arrangement of the ligands, of the type of substituents and of the counter ion of the copper salts employed for the complexation was examined. Correlations were found between the binding constants of the [ML 2 ] + complexes in solution and the relative stabilities of the analogous complexes in the gas phase. Furthermore, complexation with the ligands 2,11‐dialkylated 1,12‐diazaperylenes [alkyl = ethyl ( dedap ) and isopropyl ( dipdap )] was studied in the solvents CH 3 OH and CH 3 CN. Copyright © 2010 John Wiley & Sons, Ltd.