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Total quality control for a surface mount technology process for the manufacture of printed circuit board assemblies
Author(s) -
Chan LingYau,
Law Lawrence WingTung
Publication year - 1995
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680110503
Subject(s) - surface mount technology , quality (philosophy) , printed circuit board , product (mathematics) , mount , process (computing) , electronics , manufacturing engineering , engineering , total quality management , control (management) , computer science , mechanical engineering , electrical engineering , artificial intelligence , mathematics , philosophy , geometry , epistemology , lean manufacturing , operating system
Surface mount technology is used widely nowadays in the manufacture of printed circuit board assemblies in the electronics industry. The occurrence of defective products when this technology is used is mostly caused by technological problems, but sometimes it is also caused by management problems or human errors. When technological problems are being tackled, human interactions will always be involved. This is because the quality of a product is related to the quality of the material, the design of the product and the manufacturing process, and as tasks are subdivided, problems occurring in production cannot be solved completely by the sole effort of a single individual. Hence improvement of product quality involes man, machine , and material. This article explains how quality problems arising from surface mount technology are tackled by team effort in an organization via the implementation of a process‐oriented total quality control system.