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Fracture mechanical characterization of IC‐device interfaces
Author(s) -
Burger K.
Publication year - 1995
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680110415
Subject(s) - materials science , soldering , fracture (geology) , composite material , characterization (materials science) , stress (linguistics) , paint adhesion testing , adhesion , structural engineering , nanotechnology , engineering , linguistics , philosophy
To characterize the bond‐strength or adhesion of the different interfaces in plastic encapsulated ICs a fracture‐mechanical test method has been used. For this four‐point‐bend test a preparation method has been developed to get the four‐point‐bend test samples out of the moulded IC devices. The measurement of the adhesion along the main phase boundaries of plastic encapsulated devices before and after stress‐tests (HAST, pressure‐cooker, solder dips, temperature cycles) was done also to characterize the change in bond‐strength during those tests. A mechanical model is presented which helps to describe the PC‐specific corrosion phenomena as well as failures resulting from temperature cycle tests.