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Electrical measurements as performance indicators of electromigration
Author(s) -
Jones B. K.,
Xu Y. Z.,
Denton T. C.
Publication year - 1994
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680100411
Subject(s) - electromigration , materials science , electrical resistivity and conductivity , electrical current , electrical resistance and conductance , electrical engineering , composite material , engineering
Measurements were made of various electrical parameters on metal interconnects at intervals during electromigration life tests. The results show a close correlation between the progression of electro‐migration and increases of the resistance values, harmonic content and excess noise. Also, the statistical trend of the variations of these parameters with normalized lifetime for a number of failed samples is very consistent with the trend during a continuously monitoring experiment, where the electrical properties of tracks were monitored continuously while being electrically and thermally stressed. There are implications in the potential importance of such measurements for the non‐destructive tests of electromigration.