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Integration of efforts for the reliability of microelectronic devices
Author(s) -
Gerling W.
Publication year - 1994
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680100403
Subject(s) - reliability (semiconductor) , reliability engineering , vendor , product (mathematics) , microelectronics , field (mathematics) , engineering , computer science , manufacturing engineering , business , mathematics , electrical engineering , power (physics) , physics , geometry , marketing , quantum mechanics , pure mathematics
The expected levels of product reliability will no longer be measurable at product qualification. The control of reliability must be completely changed to proactive measures. This requires close customer‐vendor relationships in early phases of specification and qualification, basic solutions by robust design and tough manufacturing engineering with zero defect targets. This changing situation is illustrated by some examples in the very diverse field of contributions to reliability. Improved cooperation is required for more efficient reliability progress.