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A computer‐controlled environmental test system for high pin‐count integrated circuit packages
Author(s) -
Barrett John,
Donavan John Ó,
Hayes Thomas,
Mathúna Seán C.Ó
Publication year - 1993
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680090206
Subject(s) - reliability (semiconductor) , surface mount technology , printed circuit board , integrated circuit , electronic circuit , soldering , mount , joint (building) , software , engineering , circuit reliability , reliability engineering , embedded system , computer hardware , computer science , electrical engineering , mechanical engineering , materials science , structural engineering , programming language , power (physics) , physics , quantum mechanics , composite material
An automated environmental stress testing system, designed and assembled for testing of high pin‐count integrated circuit packages and surface mount solder joint reliability is described. Details are given of the software and hardware used in the control of the environment chambers used, in monitoring of test specimen reliability parameters and in control and monitoring of special purpose integrated circuits for testing of IC package reliability. In addition, an automatic system for monitoring of the resistance of fine pitch surface mount solder joints and for detection and recording of thermally induced intermittent open circuits in these joints is described.