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Reliability and robustness of thin film composite resistor networks
Author(s) -
Sachaf A.,
Klein I. E.
Publication year - 1992
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680080604
Subject(s) - resistor , robustness (evolution) , composite number , reliability (semiconductor) , reliability engineering , materials science , electronic circuit , tantalum nitride , electronic engineering , computer science , electrical engineering , tantalum , engineering , composite material , physics , voltage , biochemistry , chemistry , power (physics) , quantum mechanics , metallurgy , gene
Abstract Reliability of composite NiCr–tantalum nitride resistors was tested according to MIL STD 883 procedures. It was shown analytically and experimentally that these resistors are robust and stable, and they can thus be recommended for use in precise and reliable integrated circuits.

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