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Ultrasonic microscope investigations of die attach quality and correlations with thermal resistance
Author(s) -
Pfannschmidt Gabriele
Publication year - 1992
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680080312
Subject(s) - microscope , delamination (geology) , scanning acoustic microscope , die (integrated circuit) , materials science , acoustic microscopy , ultrasonic sensor , optical microscope , microscopy , thermal , composite material , acoustics , optics , nanotechnology , scanning electron microscope , paleontology , physics , subduction , biology , tectonics , meteorology
In the semiconductor industry the use of ultrasonic microscopes for evaluating the integrity of the bond between adjacent surfaces has increased dramatically over the last few years. These instruments are rapidly becoming an acceptable diagnostic tool in the QC laboratory and new specifications have been written incorporating them into MIL requirements. Especially in the non‐destructive investigation of plastic encapsulated ICs for delaminations, cracks, voids, and die‐bonding faults ultrasonic microscopy has great advantages. The main equipment used is SLAM (or through transmission mode acoustic microscope) with a frequency range of 10–200 MHz and C‐SAM (or reflective mode acoustic microscope) working in the range 5–100 MHz. In this paper, standard measurements of die attach quality and thermal resistance are correlated with C‐SAM results. A general correlation between the amount of delamination and the measured thermal resistance was found.