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Low‐cost physical analysis techniques for the failure analysis of semiconductor components
Author(s) -
Glacet J. Y.,
Dall'oro G. Guerri
Publication year - 1992
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680080204
Subject(s) - reliability engineering , voltage , semiconductor , failure mode and effects analysis , cost analysis , computer science , integrated circuit , engineering , semiconductor device , electronic engineering , electrical engineering , materials science , nanotechnology , layer (electronics)
Failure analysis of semiconductor components should not only be considered as an ever increasing costly activity which is economically difficult to support, to develop, and to justify, because of the continuous technology evolution. Analytical techniques such as integrated circuit pin‐to‐pin electrical test, plastic package opening with the acid dropper, hot spot detection with liquid crystals, EBIC, voltage contrast in static and voltage coding modes, can be developed and applied in failure analysis laboratories with low‐cost equipment. Although they are not intended to replace some well‐known expensive and sophisticated analytical tools, they can provide efficient results.