Premium
The effect of barrier layers on the distribution function of interconnect electromigration failures
Author(s) -
Pinto Mario
Publication year - 1991
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680070415
Subject(s) - electromigration , interconnection , materials science , composite material , computer science , telecommunications
Electromigration data after stressing narrow lines with or without a TiW layer underneath have been analysed. The difference between the failure morphology and the failure time distributions is explained and a new statistical failure model is derived to explain the differences in electromigration observations.