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Failure analysis using ferroelectric liquid crystals
Author(s) -
Picart B.,
Arranz A.,
Oustry G.,
Tromeur B.
Publication year - 1991
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680070409
Subject(s) - ibm , visualization , very large scale integration , materials science , laser , computer science , ferroelectricity , electronic engineering , reliability engineering , mechanical engineering , optoelectronics , engineering , optics , nanotechnology , physics , dielectric
Abstract The complexity of present VLSI chips requires powerful tools to detect possible defects. For such a purpose, internal contactless testing methods such as electron beam or laser testing, have been developed to help the precise localization of the electrical defect. The aim of this paper is to describe the liquid crystals test method, used at the IBM COMPEC laboratory for failure analysis. The electro‐optical properties of these materials allow the visualization of electric signals on the chips surface.